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HomeAdhesive CompatibilityUV Encapsulation & Potting Resins
Adhesive Compatibility

Curing UV Encapsulation & Potting Resins

Resins that seal and protect components, cured as deep as the light penetrates, with dual-cure options for shadowed volume under parts.

Chemistry family
Acrylate / cationic (thick-section)
Cure mechanism
hybrid
Common cure bands
365 nm / 395 nm / 405 nm

How It Cures

Cure depth depends on wavelength, intensity, and the resin’s rating; deep pots are cured in layers or use a dual-cure (heat/moisture) mechanism for volume the light can’t reach.

Through a substrate: Cured into the pot from above and from multiple angles for shadowed volume.

Recommended system
SunSpot 2 ›

For depth you want penetration, the SunSpot 2’s broad spectrum and high intensity drive cure deeper into a thick film, and a high-flux guide plus splitter light the pot from several angles.

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Always confirm the exact cure wavelength and dose on your adhesive’s own datasheet, this page describes how the chemistry class behaves, not a specific product.

RelatedUV Encapsulating & Sealing Small Electronics ›·Curing UV Adhesive in a Recessed or Blind Hole ›·Curing Shadowed or Hidden UV Joints ›
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