UV Spot Curing for Microfluidics & Lab-on-Chip
Microfluidic and lab-on-chip devices are bonded and sealed through clear polymer or glass, at small scale, where cure stress and wavelength transmission decide whether the channel survives. UV spot curing sets these bonds precisely and through the substrate.
Bonding through PMMA, polycarbonate, or glass means the wavelength has to pass the material, longer bands transmit where short UV is blocked, and the adhesive must cure low-stress so channels don’t deform. Matched LED wavelength selection is the key capability.
Recommended Systems
Four selectable bands (365/385/395/405 nm) to match the wavelength your substrate transmits and your adhesive cures at, with low heat.
Quote the SkyBeamBroad spectrum when the chemistry isn’t pinned down, its longer wavelengths pass through clear polymers and glass.
Quote the SunSpot 2Curing Tasks in This Industry
Questions
How do you UV-bond microfluidic chips through clear plastic?
Use a wavelength the substrate transmits, polycarbonate and PMMA pass longer UVA (395–405 nm) while blocking short UV, with a low-stress adhesive tuned to that band. The SkyBeam’s selectable channels let you match the wavelength to the material and chemistry.
What UV system suits microfluidics assembly?
A wavelength-matched LED system like the SkyBeam, for its selectable bands and low heat, is the usual fit; a broad-spectrum SunSpot 2 is the safe pick when the adhesive chemistry isn’t finalized.
